Advanced Circuits is the ideal printed circuit board manufacturer for your HDI PCB (High Density Interconnect Printed Circuit Board) requirements. Since 1989, the company has been known as an industry leader for its quality, precision, and on-time reliability. With recent acquisitions, Advanced Circuits has expanded its printed circuit board manufacturing capabilities to include some of the most advanced and powerful PCB solutions that range from the simplest designs to the most rigorous requirements for the medical, commercial, defense, and aerospace marketplace.
Advanced Circuits also offers in-house PCB assembly service for quickturn prototype quantities, making turnkey HDI PCB assembly an easy and seamless process. Our printed circuit board assembly service is North America’s leading one-stop solution for PCB and assembly under one roof supporting Ball Grid Arrays (BGA) as small as .35mm pitch (all BGAs are x-ray inspected), fine pitch components as small as 15 mil pitch, and passive components as small as 0201 with design review. We can provide low-cost first article builds and have no minimum order requirements.
Advanced Technology for HDI PCB Fabrication
You can rely on Advanced Circuits state-of-the-art equipment and experience in cutting-edge precision work for your most rigorous HDI PCB requirements. We can achieve the highest quality with in-house laser drill capabilities that include precise depth control. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features. Our advanced circuit board manufacturing capabilities include:
- Buried Chip Resistors
- Blind and Buried Vias
- Stacked Microvias
- Laser Drilled Microvias
- Up to 40 layers
- Laser Direct Imaging (LDI)
- .00275″ Trace/Space
- Down to .3mm Pitch
- Air Pockets between layers
- Via-in-Pad
- Multilayer RF Designs
- Cavity Boards
- Advanced PCB Laminate/Material Options
For a complete list of PCB fabrication capabilities, click here.
Advanced Circuits HDI PCB Specifications
Total Pad Size | Typical | Advanced |
Capture Pad | Drill + 0.008 | Drill + 0.006 |
Landing Pad | Drill + 0.008 | Drill + 0.006 |
BC Mechanical Drill (Type III) | 0.008 | 0.006 |
Laser Drill Size | 0.004-0.010 | 0.0025 |
Material Thickness | 0.0035 | 0.0025 |
Stacked Via | Yes | Yes |
Type I Capabilities single & Double Deep | Yes | Yes |
Type II Capabilities Buried Vias with Microvias | Yes | Yes |
Type III Capabilities | Yes | Yes |
Copper Filled Microvia | Yes | Yes |
Smallest Copper Filled Microvia | 0.004 | 0.0025 |
Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:1 |
Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:1 |